Production programme

program

Mounting of printed circuit boards with SMT technology

Setting the PCB

Solder paste application

are realized by means of metal templates on automatic screen printing equipment VERSAPRINT or manual equipment UNIPRINT.
the maximum size of the printed motif is 610×510 mm.
we use solder paste from Kester, others on request

Setting the PCB

SMD assembly is performed on SAMSUNG SM-421 or SAMSUNG DECAN F2. The assembly capacity is 75,000 components per hour according to IPC. Our technological equipment allows us to assemble SMD components in a wide range of sizes: 0201, 0402, 0603, 0805, 1206 …, SOT23, SOT89, SOT122, SO8, SO16, PLCC4-84, QFP 0.5mm, BGA ….

Substrates needed for SMT circuit board assembly:

parts schedule (preferably Excel)
installation plan (preferably in PDF format)
specification of the procedure (if necessary)
coordinates of the centres of the parts (preferably in Excel)
files for making paste templates (Gerber)

Remelting solder paste

Remelting takes place in an inert atmosphere. For this operation we use steam brazing technology. This ensures that no oxidation of the solder occurs during soldering and the parts are soldered with high quality. In this area we use equipment from IBL and ASSCON.

PCB mounting using classic THT technology

Setting the PCB

Shaping, cutting and assembly of the components is done manually on separate jigs. To speed up these operations, it is advisable that the parts are not loose, but in tape/roll or tape/ammopack. However, this is not a requirement.

Documents required for mounting printed circuit boards using THT technology:

parts schedule (Excel)
installation plan (preferably in PDF format)
specification of the procedure (if necessary)

Soldering printed circuit boards using SMT technology:

Soldering is carried out on the VERSAFLOW 345 selective soldering machine from ERSA. This process takes place in a nitrogen atmosphere, which ensures that the solder does not oxidize during soldering. In cases where these devices cannot be used, we solder by hand. We use soldering stations from JBC, where the soldering temperature can be set and the operator is not able to change this temperature. In both cases (machine and hand soldering) we use lead-free or lead solder according to the customer’s requirement and future use of the board.

Optical controls and intermediates in production

100% of the installed PCBs are optically inspected. This inspection is carried out either on a Marantz FDL520 or with a microscope and magnifying glass as required. Since several companies require soldering and inspection according to the IPC-A-610 standard, the resulting optical inspection of the boards is performed using a 3D microscope. All assembled boards can be cleaned by washing in an automatic large capacity Super SWASH or ultrasonic cleaner, depending on the customer’s requirements. The washing process gets rid of unwanted flux residues from the soldering process, which could shorten the solder lifetime. If the board is to be painted, washing the board is essential.

Reviving and finishing printed circuit boards

The revival and modification of the plates is carried out according to the customer’s requirements. In most cases, single-purpose test equipment is used. For this activity it is necessary to provide documentation for testing and a drawing of the connection of the test equipment.

Completion of equipment

According to the customer’s requirements, we also perform the final finishing of the products, including installation in cabinets, cabling and final packaging.