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SMT assembling of PCBs

Application of soldering paste

  • Done with metal stencils by screen printing machine VERSAPRINT or by manually controlled machine UNIPRINT
  • Maximum size of printed pattern is 610mm x 510mm
  • We use soldering paste from Kester company, other types only when requested

PCB Assembling

PCB assembling is run by SM-421 or DECAN F2 machines by SAMSUNG. Capacity of both machines altogether is 75 000 per hour in accordance with IPC. Our technology allows us to assemble components of this size:
0201, 0402, 0603, 0805, 1206 …, SOT23, SOT89, SOT122, SO8, SO16, PLCC4-84, QFP 0,5mm, BGA …


Technical bases needed for SMT assembling:

  • List of components (MS Excel if possible)
  • Assembly plan (PDF if possible)
  • Specification of procedure (if needed)
  • Coordinates of components centres (MS Excel if possible)
  • Gerber files for stencil production


Soldering paste melting

Melting is carried out in an inert atmosphere. For this operation we use vapour soldering technology. This technology prevents solder from oxidation and components are soldered in high quality. The operation is done with equipment by ASSCON and IBL company.

THT assembling of PCBs

PCB Assembling

Shaping, cutting and assembling of components is done manually with bending jigs. For faster work it is recommended not to send bulk components. Tape/reel or taped/ammopack version is more convenient. This is, however, not a condition.


Technical bases needed for THT assembling:

  • List of components (MS Excel)
  • Assembly plan (PDF)
  • Specification of procedure (if needed)


PCB soldering

Soldering is carried out by VERSAFLOW 345 machines for selective soldering from ERSA company. This procedure is executed in an inert atmosphere, so that we avoid oxidation of solder during the procedure. In case it is not possible to use these machines, we solder manually with JBC soldering stations, on which the soldering temperature is adjustable and the operator cannot change it. In both cases we use lead or lead-free tin depending on customers demands and the assumed purpose of the product.




Optical control and cleaning

100% of assembled PCBs are under optical control. This control is carried out by FDL520 machine by MARANTZ company or by microscope and zooming tool. Many customers demand soldering and control according to IPC-A-610, therefore final optical control is done by 3D microscope.
It is possible to clean assembled boards in automatic large-capacity Super-SWASH machine or in ultrasonic machine. Cleaning will eliminate flux residuals left on board after soldering. These residuals could affect the durability of the board. If the board is supposed to be lackered, cleaning is necessary.

Software debugging and adjustment of PCBs

Software debugging and adjustment of boards is done according to customer´s request. Mostly single-purpose test equipment is used. This activity requires documentation for testing and connection drawing of test equipment.

Assembling of the devices

According to customer´s requests we also finalize products, including installation into covers and cabling.