PCB assembling is run by SM-421 or DECAN F2 machines by SAMSUNG. Capacity of both machines altogether is 75 000 per hour in accordance with IPC. Our technology allows us to assemble components of this size:
0201, 0402, 0603, 0805, 1206 …, SOT23, SOT89, SOT122, SO8, SO16, PLCC4-84, QFP 0,5mm, BGA …
Melting is carried out in an inert atmosphere. For this operation we use vapour soldering technology. This technology prevents solder from oxidation and components are soldered in high quality. The operation is done with equipment by ASSCON and IBL company.
Shaping, cutting and assembling of components is done manually with bending jigs. For faster work it is recommended not to send bulk components. Tape/reel or taped/ammopack version is more convenient. This is, however, not a condition.
Soldering is carried out by VERSAFLOW 345 machines for selective soldering from ERSA company. This procedure is executed in an inert atmosphere, so that we avoid oxidation of solder during the procedure. In case it is not possible to use these machines, we solder manually with JBC soldering stations, on which the soldering temperature is adjustable and the operator cannot change it. In both cases we use lead or lead-free tin depending on customers demands and the assumed purpose of the product.